Methods and Apparatus for Making Elastic Laminates

ABSTRACT

Aspects of methods and apparatuses herein relate to making elastic laminates, and more particularly, methods and apparatuses for applying fluids onto elastic material positioned on an advancing substrate. The elastic material may be in various forms, such as for example, elastic strands, ribbons, and/or panels. Particular embodiments of the apparatuses and methods disclosed herein provide for the application of viscous fluids, such as adhesives, in pre-determined patterns to elastic material positioned on an advancing substrate.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation of application Ser. No. 14/974,205filed on Dec. 18, 2015, which is a continuation of application Ser. No.13/685,844 filed on Nov. 27, 2012, both of which are incorporated hereinby reference.

FIELD OF THE INVENTION

The present disclosure relates to methods for manufacturing absorbentarticles, and more particularly, to apparatuses and methods for makingelastic laminates for absorbent articles.

BACKGROUND OF THE INVENTION

Along an assembly line, various types of articles, such as for example,diapers and other absorbent articles, may be assembled by addingcomponents to and otherwise modifying an advancing, continuous web ofmaterial. For example, in some processes, advancing webs of material arecombined with other advancing webs of material. In other examples,individual components created from advancing webs of material arecombined with advancing webs of material, which in turn, are thencombined with other advancing webs of material. Webs of material andcomponent parts used to manufacture diapers may include: backsheets,topsheets, absorbent cores, front and/or back ears, fastener components,and various types of elastic webs and components such as leg elastics,barrier leg cuff elastics, and waist elastics. Once the desiredcomponent parts are assembled, the advancing web(s) and component partsare subjected to a final knife cut to separate the web(s) into discretediapers or other absorbent articles. The discrete diapers or absorbentarticles may also then be folded and packaged.

Various methods and apparatuses may be used for attaching differentcomponents to the advancing web and/or otherwise modify the advancingweb. For example, some production operations are configured to applyrelatively high viscosity fluids, such as hot melt adhesives, to elasticstrands to be combined with an advancing web to create an elasticlaminate. In some instances, the production operations are configured toapply hot melt adhesives to advancing elastic strands and/or a web inpre-determined patterns. These operations may include the use of systemsand methods such as slot die coating, direct gravure, offset gravure andreverse gravure roll coating processes that are extensively described inthe art. However, current systems and methods for applying adhesives toan advancing substrate and/or elastic strands may have certainlimitations.

For example, some manufacturing processes of absorbent articles such asfeminine hygiene pads, baby diapers, and adult incontinence pads useelectro-pneumatic switching valves to intermittently transfer adhesiveto advancing elastic strands and/or substrates. However, the quality andprecision of intermittent transfer of fluids to advancing elasticsand/or substrates may be limited by the speed of the on/off cycle ofswitching valves used to interrupt the flow of fluid to the adhesiveapplicator. Thus, as web processing speeds increase, the ability ofcurrent adhesive application methods to achieve fine resolution ofon/off coat patterns in the direction of web travel decreases.Consequently, it would be beneficial to provide apparatuses and methodsthat apply adhesives and other fluids to a substrate in patterns withrelatively high resolution and high speeds without being limited by thespeed of on/off cycling of switching valves used to interrupt the flowof fluid to the slot die of the fluid applicator.

SUMMARY OF THE INVENTION

Aspects of methods and apparatuses herein relate to making elasticlaminates, and more particularly, methods and apparatuses for applyingfluids onto elastic material positioned on an advancing substrate. Theelastic material may be in various forms, such as for example, elasticstrands, ribbons, and/or panels. Particular embodiments of theapparatuses and methods disclosed herein provide for the application ofviscous fluids, such as adhesives, in pre-determined patterns to elasticmaterial positioned on an advancing substrate.

In one form, a method may be used to apply adhesive discharged from aslot die applicator to a substrate and an elastic material, the slot dieapplicator including a slot opening, a first lip, and a second lip, theslot opening located between the first lip and the second lip; whereinthe substrate has a first surface disposed opposite of a second surfaceand an unconstrained caliper, Hs, and wherein the elastic material has amaximum thickness, Et. The method includes the steps of: advancing thesubstrate in a machine direction; advancing the elastic material in themachine direction; positioning the elastic material on the secondsurface of the substrate; engaging the substrate with a substratecarrier, the substrate carrier comprising: a non-compliant supportsurface and a pattern element, the pattern element including a patternsurface, the substrate carrier positioned adjacent the slot dieapplicator to define a minimum distance, Hg, between the pattern surfaceof the pattern element and the first lip and the second lip of the slotdie applicator that is less than the sum of the unconstrained caliper,Hs, of the substrate and the maximum thickness, Et, of the elasticmaterial; advancing the second surface of the substrate and the elasticmaterial past the slot die applicator while the first surface of thesubstrate is disposed on the substrate carrier; intermittentlydeflecting a first portion of the pattern surface toward thenon-compliant support surface by advancing the substrate and the elasticmaterial between the pattern element and the first lip, the slotopening, and the second lip of the slot die applicator while the firstsurface of the substrate is disposed on the substrate carrier; anddischarging adhesive from the slot opening of the slot die applicatoronto the elastic material and the second surface of the substrate.

In another form, a method may be adapted to apply adhesive dischargedfrom a slot die applicator to a substrate and an elastic material, theslot die applicator including a slot opening, a first lip, and a secondlip, the slot opening located between the first lip and the second lipof the slot die applicator; wherein the substrate has a first surfacedisposed opposite of a second surface and an unconstrained caliper, Hs,and wherein the elastic material has a maximum thickness, Et. The methodincludes the steps of: advancing the substrate in a machine direction;advancing the elastic material in the machine direction; positioning theelastic material on the second surface of the substrate; engaging thesubstrate with a substrate carrier, the substrate carrier comprising: apattern element including a pattern surface, the substrate carrierpositioned adjacent the slot die applicator to define a minimumdistance, Hg, between the pattern surface of the pattern element and thefirst lip and the second lip that is less than the sum of theunconstrained caliper, Hs, of the substrate and the maximum thickness,Et, of the elastic material; advancing the second surface of thesubstrate and the elastic material past the slot die applicator whilethe first surface of the substrate is disposed on the substrate carrier;intermittently deflecting a first portion of the pattern surface awayfrom the slot die applicator by advancing the substrate and the elasticmaterial between the pattern element and the first lip, the slotopening, and the second lip of the slot die applicator while the firstsurface of the substrate is disposed on the substrate carrier; anddischarging adhesive from the slot opening of the slot die applicatoronto the elastic material and the second surface of the substrate.

In yet another form, a method for making an elastic laminate includesthe steps of: advancing a substrate, the substrate comprising a firstsurface disposed opposite of a second surface; positioning the elasticmaterial on the second surface of the substrate; engaging the substratewith a substrate carrier, the substrate carrier comprising: a patternelement including a pattern surface, the substrate carrier positionedadjacent the slot die applicator to define a minimum distance, Hg,between the pattern surface of the pattern element and the first lip andthe second lip of the slot die applicator that is less than the sum ofthe unconstrained caliper, Hs, of the substrate and the maximumthickness, Et, of the elastic material; advancing the second surface ofthe substrate and the elastic material past the slot die applicatorwhile the first surface of the substrate is disposed on the substratecarrier; intermittently deflecting a first portion of the patternsurface away from the slot die applicator by advancing the substrate andthe elastic material between the pattern element and the first lip, theslot opening, and the second lip of the slot die applicator while thefirst surface of the substrate is disposed on the substrate carrier; anddischarging adhesive from the slot opening of the slot die applicatoronto the elastic material and the second surface of the substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a diaper pant.

FIG. 2A is a partially cut away plan view of the diaper pant shown inFIG. 1.

FIG. 3A is a cross-sectional view of the diaper pants of FIG. 2A takenalong line 3A-3A.

FIG. 3B is a cross-sectional view of the diaper pants of FIG. 2A takenalong line 3B-3B.

FIG. 4 is a perspective view of a fluid application apparatus positionedadjacent to an advancing substrate and elastic material.

FIG. 4A is a front side view of a fluid application apparatus depositingfluid onto an advancing substrate and elastic material in a firstexample pattern.

FIG. 4B is a front side view of a fluid application apparatus depositingfluid onto an advancing substrate and elastic material in a secondexample pattern.

FIG. 4C is a front side view of a fluid application apparatus depositingfluid onto an advancing substrate and elastic material in a thirdexample pattern.

FIG. 4D is a front side view of a fluid application apparatus depositingfluid onto an advancing substrate and elastic material in a fourthexample pattern.

FIG. 5A is a perspective view of an embodiment of a substrate carrierincluding a pattern roller having a continuous base surface and aplurality of pattern surfaces.

FIG. 5B is a detailed cross-sectional view of the substrate carriershown in FIG. 5A taken along the line 5B-5B.

FIG. 5C is a top side view of a substrate and elastic material showing afirst example adhesive pattern thereon.

FIG. 6A is a perspective view of an embodiment of a substrate carrierincluding a pattern roller having a continuous pattern surface andplurality of base surfaces.

FIG. 6B is a detailed cross-sectional view of the substrate carriershown in FIG. 6A taken along the line 6B-6B.

FIG. 6C is a top side view of a substrate showing a second exampleadhesive pattern thereon.

FIG. 7 is a schematic cross-sectional side view of an example substratecarrier.

FIG. 7A1 is a detailed view of the substrate carrier of FIG. 7 includinga compliant pattern element and a compliant base layer connected with abase roll.

FIG. 7A2 is a detailed view of the pattern surface of the patternelement from FIG. 7A1 deflected by a force or forces applied to thepattern surface.

FIG. 7B1 is a detailed view of the substrate carrier of FIG. 7 includinga non-compliant pattern element and a compliant base layer connectedwith a base roll.

FIG. 7B2 is a detailed view of the pattern surface of the patternelement from FIG. 7B1 deflected by a force or forces applied to thepattern surface.

FIG. 7C1 is a detailed view of the substrate carrier of FIG. 7 includinga compliant pattern element connected with a base roll.

FIG. 7C2 is a detailed view of the pattern surface of the patternelement from FIG. 7C1 deflected by a force or forces applied to thepattern surface.

FIG. 8 is a schematic cross-sectional side view of a fluid applicationapparatus applying fluid to a substrate and elastic material.

FIG. 8A is a schematic side view of a first converting configuration formaking an elastic laminate.

FIG. 8A1 is a view of a continuous length of an elastic laminate fromFIG. 8A taken along line 8A1-8A1.

FIG. 8B is a schematic side view of a second converting configurationfor making an elastic laminate.

FIG. 8B1 is a view of a continuous length of an elastic laminate fromFIG. 8B taken along line 8B1-8B1.

FIG. 8C is a schematic side view of a third converting configuration formaking an elastic laminate.

FIG. 8C1 is a view of a continuous length of an elastic laminate fromFIG. 8C taken along line 8C1-8C1.

FIG. 8C2 is a view of a continuous length of an elastic laminate fromFIG. 8C taken along line 8C2-8C2.

FIG. 9A is a detailed cross-sectional view of the substrate carrier ofFIG. 8 without the substrate and elastic material wherein the patternsurface of a pattern element is adjacent a first lip, a second lip, andslot opening of the slot die applicator.

FIG. 9B is a detailed cross-sectional view of a substrate carrier, asubstrate, and an elastic material advancing past a slot die applicatorand showing the substrate and elastic material between a slot opening ofthe slot die applicator and an advancing base surface.

FIG. 9C is a detailed cross-sectional view of the substrate carrier,substrate, and elastic material of FIG. 9B wherein the base surface isadvancing past the slot opening of the slot die applicator such that thesubstrate and elastic material are between the slot opening of the slotdie applicator and a leading edge of an advancing pattern surface.

FIG. 9CC1 is a cross-sectional view of the substrate carrier and fluidapplication device showing an elastic strand and substrate taken alongthe line CC-CC in FIG. 9C.

FIG. 9CC2 is a cross-sectional view of the substrate carrier and fluidapplication device showing an elastic film and substrate taken along theline CC-CC in FIG. 9C.

FIG. 9D is a detailed cross-sectional view of the substrate carrier,substrate, and elastic material of FIG. 9C wherein the base surface hasadvanced past the slot opening of the slot die applicator such that thesubstrate and elastic material are between the slot opening of the slotdie applicator and an advancing pattern surface.

FIG. 9E is a detailed cross-sectional view of the substrate carrier andsubstrate of FIG. 9D wherein the pattern surface has advanced past theslot opening of the slot die applicator.

FIG. 10 is a schematic cross-sectional side view of an embodiment of afluid application apparatus with a substrate carrier including a patternbelt.

FIG. 11 is a schematic cross-sectional side view of another embodimentof a fluid application apparatus with a substrate carrier including apattern belt.

FIG. 12 is a schematic cross-sectional side view of another embodimentof a fluid application apparatus with a substrate carrier including apattern belt and a backup plate.

DETAILED DESCRIPTION OF THE INVENTION

The following term explanations may be useful in understanding thepresent disclosure:

“Absorbent article” is used herein to refer to consumer products whoseprimary function is to absorb and retain soils and wastes. Non-limitingexamples of absorbent articles include diapers, training pants, pull-onpant-type diapers, refastenable diapers or pant-type diapers,incontinence briefs and undergarments, diaper holders and liners,feminine hygiene garments such as panty liners, absorbent inserts, andthe like.

“Diaper” is used herein to refer to an absorbent article generally wornby infants and incontinent persons about the lower torso.

The term “disposable” is used herein to describe absorbent articleswhich generally are not intended to be laundered or otherwise restoredor reused as an absorbent article (e.g., they are intended to bediscarded after a single use and may also be configured to be recycled,composted or otherwise disposed of in an environmentally compatiblemanner).

The term “disposed” is used herein to mean that an element(s) is formed(joined and positioned) in a particular place or position as amacro-unitary structure with other elements or as a separate elementjoined to another element.

As used herein, the term “joined” encompasses configurations whereby anelement is directly secured to another element by affixing the elementdirectly to the other element, and configurations whereby an element isindirectly secured to another element by affixing the element tointermediate member(s) which in turn are affixed to the other element.

The term “substrate” is used herein to describe a material which isprimarily two-dimensional (i.e. in an XY plane) and whose thickness (ina Z direction) is relatively small (i.e. 1/10 or less) in comparison toits length (in an X direction) and width (in a Y direction).Non-limiting examples of substrates include a layer or layers or fibrousmaterials, films and foils such as plastic films or metallic foils thatmay be used alone or laminated to one or more web, layer, film and/orfoil. As such, a web is a substrate.

The term “nonwoven” refers herein to a material made from continuous(long) filaments (fibers) and/or discontinuous (short) filaments(fibers) by processes such as spunbonding, meltblowing, and the like.Nonwovens do not have a woven or knitted filament pattern.

The term “machine direction” (MD) is used herein to refer to thedirection of material flow through a process. In addition, relativeplacement and movement of material can be described as flowing in themachine direction through a process from upstream in the process todownstream in the process.

The term “cross direction” (CD) is used herein to refer to a directionthat is generally perpendicular to the machine direction.

The terms “elastic” and “elastomeric” as used herein refer to anymaterial that upon application of a biasing force, can stretch to anelongated length of at least about 110% of its relaxed, original length(i.e. can stretch to 10% more than its original length), without ruptureor breakage, and upon release of the applied force, recovers at leastabout 40% of its elongation. For example, a material that has an initiallength of 100 mm can extend at least to 110 mm, and upon removal of theforce would retract to a length of 106 mm (40% recovery). The term“inelastic” refers herein to any material that does not fall within thedefinition of “elastic” above.

The term “extensible” as used herein refers to any material that uponapplication of a biasing force, can stretch to an elongated length of atleast about 110% of its relaxed, original length (i.e. can stretch to10%), without rupture or breakage, and upon release of the appliedforce, shows little recovery, less than about 40% of its elongation.

The terms “activating”, “activation” or “mechanical activation” refer tothe process of making a substrate, or an elastomeric laminate moreextensible than it was prior to the process.

“Live Stretch” includes stretching elastic and bonding the stretchedelastic to a substrate. After bonding, the stretched elastic is releasedcausing it to contract, resulting in a “corrugated” substrate. Thecorrugated substrate can stretch as the corrugated portion is pulled toabout the point that the substrate reaches at least one original flatdimension. However, if the substrate is also elastic, then the substratecan stretch beyond the relaxed length of the substrate prior to bondingwith the elastic. The elastic is stretched at least 25% of its relaxedlength when it is bonded to the substrate.

As used herein, the term “unconstrained caliper” refers to the caliperof the substrate measured according to Edana WSP 120.1 (05), with acircular presser foot having a diameter of 25.40±0.02 mm and an appliedforce of 2.1 N (i.e. a pressure of 4.14±0.21 kPa is applied).

As used herein, the term “compliant” refers to any material with adurometer hardness of 90 or less as measured according to ASTMInternational Designation: D2240-05 (Reapproved 2010) for Type Mdurometers.

As used herein, the term “non-compliant” refers to any material with ahardness value greater than 100 HRBW as defined on the Rockwell B Scalein the American National Standard Designation.

Aspects of the present disclosure involve methods and apparatuses formaking elastic laminates, and more particularly, methods and apparatusesfor applying fluids onto elastic material positioned on an advancingsubstrate. The elastic material may be in various forms, such as forexample, elastic strands, ribbons, and/or panels. Particular embodimentsof the apparatuses and methods disclosed herein provide for theapplication of viscous fluids, such as adhesives, in pre-determinedpatterns to elastic material positioned on an advancing substrate.Embodiments of a fluid application apparatus are discussed in moredetail below in the context of applying adhesives to an advancingsubstrate and elastics material. As discussed below, the substrate mayhave an unconstrained caliper, Hs, and has a first surface disposedopposite of a second surface, and the elastic material may have amaximum thickness, Et. The fluid application apparatus may include aslot die applicator and a substrate carrier. The slot die applicator mayinclude a slot opening, a first lip, and a second lip, the slot openinglocated between the first lip and the second lip. And the substratecarrier may be adapted to advance the substrate and the elastic materialpast the slot die applicator as the slot die applicator dischargesadhesive onto the substrate and the elastic material. In operation, whenthe first surface of the substrate is disposed on the substrate carrierand the elastic material is positioned on the second surface of thesubstrate, the substrate carrier advances the second surface of thesubstrate and the elastic material past the slot opening of the slot dieapplicator. It is to be appreciated that the apparatus and processesdisclosed herein may be used to apply various types of fluids, such asadhesives, in various different patterns to an advancing substrate andelastic materials other than those described and depicted herein.

As discussed in more detail below, the substrate carrier may include abase surface and a pattern element. The pattern element includes apattern surface and protrudes outward from the base surface. As such, insubstrate carriers configured with a base surface, the pattern surfaceand the base surface are separated by a distance, Hp. In addition, thesubstrate carrier is positioned adjacent the slot die applicator todefine a minimum distance, Hg, between the pattern surface of thepattern element and the first lip and the second lip that is less thanthe unconstrained caliper, Hs, of the substrate, and wherein a sum ofthe distance, Hp, and distance, Hg, is greater than the sum of theunconstrained caliper, Hs, of the substrate and the maximum thickness,Et, of the elastic material. Thus, as the substrate carrier advances thesecond surface of the substrate and elastic material past the slotopening, the pattern element is advanced such that the pattern surfacerepeatedly advances past the first lip, the slot opening, and the secondlip of the slot die applicator. As discussed below, the pattern elementand/or the base surface of the substrate carrier may be compliant orcompressible. And as such, the pattern element and/or the base surfaceof the substrate carrier is intermittently compressed as the substrateand elastic material advance between the slot die applicator and thepattern surface. As such, the pattern surface of the pattern elementdeflects away from the slot die applicator as the substrate, the elasticmaterial, and the pattern element advance past the first lip, the slotopening, and the second lip of the slot die applicator. As the patternsurface is intermittently deflected away from the slot die applicator,adhesive discharged from the slot die applicator is applied onto theelastic material and the second surface of the advancing substrate. Moreparticularly, the adhesive is applied to the elastic material and thesubstrate in an area having a shape that is substantially the same as ashape defined by the pattern surface.

The apparatuses and methods disclosed herein may include substratecarriers having various configurations. For example, in some embodimentsthe substrate carrier may be configured as a roller. In otherembodiments, the substrate carrier may include an endless belt. Thesubstrate carriers may also utilize various outer surface arrangements.For example, the base surface may be configured as a continuous surfaceand the substrate carrier may include a plurality of discrete patternelements separated from each other by the continuous surface. In such aconfiguration, each pattern element may include a pattern surface andeach pattern element may protrude outward from the continuous surfacesuch that each pattern surface is separated from the continuous surfaceby the distance, Hp. In another example, the pattern surface may beconfigured as a continuous surface and the base surface may include aplurality of discrete base surfaces separated from each other by thepattern element. In such a configuration, the pattern element mayprotrude outward from each of the base surfaces such that each basesurface is separated from the continuous surface by the distance, Hp. Itis to be appreciated that the pattern surface of the pattern element maybe configured in various different shapes and sizes and may beconfigured to define various different patterns. As such, adhesive maybe transferred from the slot die applicator to define various patternson a substrate.

The processes and apparatuses discussed herein may be used to assembleelastic laminates in various types of substrate configurations, some ofwhich may be used in the manufacturing of different types of absorbentarticles. To help provide additional context to the subsequentdiscussion of the process embodiments, the following provides a generaldescription of absorbent articles in the form of diapers that mayinclude elastic laminates that may be assembled in accordance with themethods and apparatuses disclosed herein. Although the methods andapparatuses herein are discussed below in the context of manufacturingabsorbent articles, it is to be appreciated that the assembly methodsand apparatuses herein may be configured to manufacture various types ofelastic laminates.

FIGS. 1 and 2A show an example of a diaper 100 that may include elasticlaminates assembled in accordance with the apparatuses and methodsdisclosed herein. In particular, FIG. 1 shows a perspective view of adiaper pant 100 in a pre-fastened configuration, and FIG. 2A shows aplan view of the diaper pant 100 with the portion of the diaper thatfaces away from a wearer oriented towards the viewer. The diaper pant100 shown in FIGS. 1 and 2A includes a chassis 102 and a ring-likeelastic belt 104. As discussed below in more detail, a first elasticbelt 106 and a second elastic belt 108 are connected together to formthe ring-like elastic belt 104.

With continued reference to FIG. 2A, the chassis 102 includes a firstwaist region 116, a second waist region 118, and a crotch region 119disposed intermediate the first and second waist regions. The firstwaist region 116 may be configured as a front waist region, and thesecond waist region 118 may be configured as back waist region. In someembodiments, the length of each of the front waist region, back waistregion, and crotch region may be ⅓ of the length of the absorbentarticle 100. The diaper 100 may also include a laterally extending frontwaist edge 120 in the front waist region 116 and a longitudinallyopposing and laterally extending back waist edge 122 in the back waistregion 118. To provide a frame of reference for the present discussion,the diaper 100 and chassis 102 of FIG. 2A is shown with a longitudinalaxis 124 and a lateral axis 126. In some embodiments, the longitudinalaxis 124 may extend through the front waist edge 120 and through theback waist edge 122. And the lateral axis 126 may extend through a firstlongitudinal or right side edge 128 and through a midpoint of a secondlongitudinal or left side edge 130 of the chassis 102.

As shown in FIGS. 1 and 2A, the diaper pant 100 may include an inner,body facing surface 132, and an outer, garment facing surface 134. Thechassis 102 may include a backsheet 136 and a topsheet 138. The chassis102 may also include an absorbent assembly 140 including an absorbentcore 142 may be disposed between a portion of the topsheet 138 and thebacksheet 136. As discussed in more detail below, the diaper 100 mayalso include other features, such as leg elastics and/or leg cuffs toenhance the fit around the legs of the wearer.

As shown in FIG. 2A, the periphery of the chassis 102 may be defined bythe first longitudinal side edge 128, a second longitudinal side edge130; a first laterally extending end edge 144 disposed in the firstwaist region 116; and a second laterally extending end edge 146 disposedin the second waist region 118. Both side edges 128 and 130 extendlongitudinally between the first end edge 144 and the second end edge146. As shown in FIG. 2A, the laterally extending end edges 144 and 146are located longitudinally inward from the laterally extending frontwaist edge 120 in the front waist region 116 and the laterally extendingback waist edge 122 in the back waist region 118. When the diaper pant100 is worn on the lower torso of a wearer, the front waist edge 120 andthe back waist edge 122 of the chassis 102 may encircle a portion of thewaist of the wearer. At the same time, the chassis side edges 128 and130 may encircle at least a portion of the legs of the wearer. And thecrotch region 119 may be generally positioned between the legs of thewearer with the absorbent core 142 extending from the front waist region116 through the crotch region 119 to the back waist region 118.

It is to also be appreciated that a portion or the whole of the diaper100 may also be made laterally extensible. The additional extensibilitymay help allow the diaper 100 to conform to the body of a wearer duringmovement by the wearer. The additional extensibility may also help, forexample, allow the user of the diaper 100 including a chassis 102 havinga particular size before extension to extend the front waist region 116,the back waist region 118, or both waist regions of the diaper 100and/or chassis 102 to provide additional body coverage for wearers ofdiffering size, i.e., to tailor the diaper to an individual wearer. Suchextension of the waist region or regions may give the absorbent articlea generally hourglass shape, so long as the crotch region is extended toa relatively lesser degree than the waist region or regions, and mayimpart a tailored appearance to the article when it is worn.

As previously mentioned, the diaper pant 100 may include a backsheet136. The backsheet 136 may also define the outer surface 134 of thechassis 102. The backsheet 136 may be impervious to fluids (e.g.,menses, urine, and/or runny feces) and may be manufactured from a thinplastic film, although other flexible liquid impervious materials mayalso be used. The backsheet 136 may prevent the exudates absorbed andcontained in the absorbent core from wetting articles which contact thediaper 100, such as bedsheets, pajamas and undergarments. The backsheet136 may also comprise a woven or nonwoven material, polymeric films suchas thermoplastic films of polyethylene or polypropylene, and/or amulti-layer or composite materials comprising a film and a nonwovenmaterial (e.g., having an inner film layer and an outer nonwoven layer).The backsheet may also comprise an elastomeric film. An examplebacksheet 136 may be a polyethylene film having a thickness of fromabout 0.012 mm (0.5 mils) to about 0.051 mm (2.0 mils). Exemplarypolyethylene films are manufactured by Clopay Corporation of Cincinnati,Ohio, under the designation BR-120 and BR-121 and by Tredegar FilmProducts of Terre Haute, Ind., under the designation XP-39385. Thebacksheet 136 may also be embossed and/or matte-finished to provide amore clothlike appearance. Further, the backsheet 136 may permit vaporsto escape from the absorbent core (i.e., the backsheet is breathable)while still preventing exudates from passing through the backsheet 136.The size of the backsheet 136 may be dictated by the size of theabsorbent core 142 and/or particular configuration or size of the diaper100.

Also described above, the diaper pant 100 may include a topsheet 138.The topsheet 138 may also define all or part of the inner surface 132 ofthe chassis 102. The topsheet 138 may be compliant, soft feeling, andnon-irritating to the wearer's skin. It may be elastically stretchablein one or two directions. Further, the topsheet 138 may be liquidpervious, permitting liquids (e.g., menses, urine, and/or runny feces)to penetrate through its thickness. A topsheet 138 may be manufacturedfrom a wide range of materials such as woven and nonwoven materials;apertured or hydroformed thermoplastic films; apertured nonwovens,porous foams; reticulated foams; reticulated thermoplastic films; andthermoplastic scrims. Woven and nonwoven materials may comprise naturalfibers such as wood or cotton fibers; synthetic fibers such aspolyester, polypropylene, or polyethylene fibers; or combinationsthereof. If the topsheet 138 includes fibers, the fibers may bespunbond, carded, wet-laid, meltblown, hydroentangled, or otherwiseprocessed as is known in the art.

Topsheets 138 may be selected from high loft nonwoven topsheets,apertured film topsheets and apertured nonwoven topsheets. Aperturedfilm topsheets may be pervious to bodily exudates, yet substantiallynon-absorbent, and have a reduced tendency to allow fluids to pass backthrough and rewet the wearer's skin. Exemplary apertured films mayinclude those described in U.S. Pat. Nos. 5,628,097; 5,916,661;6,545,197; and 6,107,539.

As mentioned above, the diaper pant 100 may also include an absorbentassembly 140 that is joined to the chassis 102. As shown in FIG. 2A, theabsorbent assembly 140 may have a laterally extending front edge 148 inthe front waist region 116 and may have a longitudinally opposing andlaterally extending back edge 150 in the back waist region 118. Theabsorbent assembly may have a longitudinally extending right side edge152 and may have a laterally opposing and longitudinally extending leftside edge 154, both absorbent assembly side edges 152 and 154 may extendlongitudinally between the front edge 148 and the back edge 150. Theabsorbent assembly 140 may additionally include one or more absorbentcores 142 or absorbent core layers. The absorbent core 142 may be atleast partially disposed between the topsheet 138 and the backsheet 136and may be formed in various sizes and shapes that are compatible withthe diaper. Exemplary absorbent structures for use as the absorbent coreof the present disclosure are described in U.S. Pat. Nos. 4,610,678;4,673,402; 4,888,231; and 4,834,735.

Some absorbent core embodiments may comprise fluid storage cores thatcontain reduced amounts of cellulosic airfelt material. For instance,such cores may comprise less than about 40%, 30%, 20%, 10%, 5%, or even1% of cellulosic airfelt material. Such a core may comprises primarilyabsorbent gelling material in amounts of at least about 60%, 70%, 80%,85%, 90%, 95%, or even about 100%, where the remainder of the corecomprises a microfiber glue (if applicable). Such cores, microfiberglues, and absorbent gelling materials are described in U.S. Pat. Nos.5,599,335; 5,562,646; 5,669,894; and 6,790,798 as well as U.S. PatentPublication Nos. 2004/0158212 and 2004/0097895.

As previously mentioned, the diaper 100 may also include elasticized legcuffs 156. It is to be appreciated that the leg cuffs 156 can be and aresometimes also referred to as leg bands, side flaps, barrier cuffs,elastic cuffs or gasketing cuffs. The elasticized leg cuffs 156 may beconfigured in various ways to help reduce the leakage of body exudatesin the leg regions. Example leg cuffs 156 may include those described inU.S. Pat. Nos. 3,860,003; 4,909,803; 4,695,278; 4,795,454; 4,704,115;4,909,803; U.S. Patent Publication No. 2009/0312730A1; and U.S. patentapplication Ser. No. 13/435,503, entitled “METHODS AND APPARATUSES FORMAKING LEG CUFFS FOR ABSORBENT ARTICLES”, filed on Mar. 30, 2012.

As mentioned above, diaper pants may be manufactured with a ring-likeelastic belt 104 and provided to consumers in a configuration whereinthe front waist region 116 and the back waist region 118 are connectedto each other as packaged, prior to being applied to the wearer. Assuch, diaper pants may have a continuous perimeter waist opening 110 andcontinuous perimeter leg openings 112 such as shown in FIG. 1.

As previously mentioned, the ring-like elastic belt 104 is defined by afirst elastic belt 106 connected with a second elastic belt 108. Asshown in FIG. 2A, the first elastic belt 106 defines first and secondopposing end regions 106 a, 106 b and a central region 106 c, and thesecond elastic 108 belt defines first and second opposing end regions108 a, 108 b and a central region 108 c.

The central region 106 c of the first elastic belt is connected with thefirst waist region 116 of the chassis 102, and the central region 108 cof the second elastic belt 108 is connected with the second waist region118 of the chassis 102. As shown in FIG. 1, the first end region 106 aof the first elastic belt 106 is connected with the first end region 108a of the second elastic belt 108 at first side seam 178, and the secondend region 106 b of the first elastic belt 106 is connected with thesecond end region 108 b of the second elastic belt 108 at second sideseam 180 to define the ring-like elastic belt 104 as well as the waistopening 110 and leg openings 112.

As shown in FIGS. 2A, 3A, and 3B, the first elastic belt 106 alsodefines an outer lateral edge 107 a and an inner lateral edge 107 b, andthe second elastic belt 108 defines an outer lateral edge 109 a and aninner lateral edge 109 b. The outer lateral edges 107 a, 109 a may alsodefine the front waist edge 120 and the laterally extending back waistedge 122. The first elastic belt and the second elastic belt may alsoeach include an outer, garment facing layer 162 and an inner, wearerfacing layer 164. It is to be appreciated that the first elastic belt106 and the second elastic belt 108 may comprise the same materialsand/or may have the same structure. In some embodiments, the firstelastic belt 106 and the second elastic belt may comprise differentmaterials and/or may have different structures. It should also beappreciated that the first elastic belt 106 and the second elastic belt108 may be constructed from various materials. For example, the firstand second belts may be manufactured from materials such as plasticfilms; apertured plastic films; woven or nonwoven webs of naturalmaterials (e.g., wood or cotton fibers), synthetic fibers (e.g.,polyolefins, polyamides, polyester, polyethylene, or polypropylenefibers) or a combination of natural and/or synthetic fibers; or coatedwoven or nonwoven webs. In some embodiments, the first and secondelastic belts include a nonwoven web of synthetic fibers, and mayinclude a stretchable nonwoven. In other embodiments, the first andsecond elastic belts include an inner hydrophobic, non-stretchablenonwoven material and an outer hydrophobic, non-stretchable nonwovenmaterial.

The first and second elastic belts 106, 108 may also each include beltelastic material interposed between the outer layer 162 and the innerlayer 164. The belt elastic material may include one or more elasticelements such as strands, ribbons, or panels extending along the lengthsof the elastic belts. As shown in FIGS. 2A, 3A, and 3B, the belt elasticmaterial may include a plurality of elastic strands 168 which may bereferred to herein as outer, waist elastics 170 and inner, waistelastics 172.

As shown in FIG. 2A, the outer, waist elastics 170 extend continuouslylaterally between the first and second opposing end regions 106 a, 106 band across the central region 106 c of the first elastic belt 106 andbetween the first and second opposing end regions 108 a, 108 b andacross the central region 108 c of the second elastic belt 108. In someembodiments, some elastic strands 168 may be configured withdiscontinuities in areas. For example, as shown in FIG. 2A, the inner,waist elastics 172 extend intermittently along the first and secondelastic belts 106, 108. More particularly, the inner, waist elastics 172extend along the first and second opposing end regions 106 a, 106 b andpartially across the central region 106 c of the first elastic belt 106.The inner, waist elastics 172 also extend along the first and secondopposing end regions 108 a, 108 b and partially across the centralregion 108 c of the second elastic belt 108. As such, the inner, waistelastics 172 do not extend across the entirety of the central regions106 c, 108 c of the first and second elastic belts 106, 108. Thus, someelastic strands 168 may not extend continuously through regions of thefirst and second elastic belts 106, 108 where the first and secondelastic belts 106, 108 overlap the absorbent assembly 140. In someembodiments, some elastic strands 168 may partially extend into regionsof the first and second elastic belts 106, 108 where the first andsecond elastic belts 106, 108 overlap the absorbent assembly 140. Insome embodiments, some elastic strands 168 may not extend into anyregion of the first and second elastic belts 106, 108 where the firstand second elastic belts 106, 108 overlap the absorbent assembly 140. Itis to be appreciated that the first and/or second elastic belts 106, 108may be configured with various configurations of discontinuities in theouter, waist elastics 170 and/or the inner, waist elastic elastics 172.

In some embodiments, the elastic strands 168 may be disposed at aconstant interval in the longitudinal direction. In other embodiments,the elastic strands 168 may be disposed at different intervals in thelongitudinal direction. As discussed in more detail below, the beltelastic strands 168, in a stretched condition, may be interposed andjoined between the uncontracted outer layer and the uncontracted innerlayer. When the belt elastic material is relaxed, the belt elasticmaterial returns to an unstretched condition and contracts the outerlayer and the inner layer. The belt elastic material may provide adesired variation of contraction force in the area of the ring-likeelastic belt. It is to be appreciated that the chassis 102 and elasticbelts 106, 108 may be configured in different ways other than asdepicted in FIG. 2A.

Components of the disposable absorbent article (i.e., diaper, disposablepant, adult incontinence article, sanitary napkin, pantiliner, etc.)described in this specification can at least partially be comprised ofbio-sourced content as described in US 2007/0219521A1 Hird et alpublished on Sep. 20, 2007, US 2011/0139658A1 Hird et al published onJun. 16, 2011, US 2011/0139657A1 Hird et al published on Jun. 16, 2011,US 2011/0152812A1 Hird et al published on Jun. 23, 2011, US2011/0139662A1 Hird et al published on Jun. 16, 2011, and US2011/0139659A1 Hird et al published on Jun. 16, 2011. These componentsinclude, but are not limited to, topsheet nonwovens, backsheet films,backsheet nonwovens, side panel nonwovens, barrier leg cuff nonwovens,super absorbent, nonwoven acquisition layers, core wrap nonwovens,adhesives, fastener hooks, and fastener landing zone nonwovens and filmbases.

In at least one exemplary configuration, a disposable absorbent articlecomponent comprises a bio-based content value from about 10% to about100% using ASTM D6866-10, method B, in another embodiment, from about25% to about 75%, and in yet another embodiment, from about 50% to about60% using ASTM D6866-10, method B.

In order to apply the methodology of ASTM D6866-10 to determine thebio-based content of any disposable absorbent article component, arepresentative sample of the disposable absorbent article component mustbe obtained for testing. In at least one embodiment, the disposableabsorbent article component can be ground into particulates less thanabout 20 mesh using known grinding methods (e.g., Wiley® mill), and arepresentative sample of suitable mass taken from the randomly mixedparticles.

As previously mentioned, the apparatuses and methods according to thepresent disclosure may be utilized to assemble elastic laminates 402used in various components of absorbent articles, such as for example,elastic belts 106, 108 and/or leg cuffs 156. Although the followingmethods may be provided in the context of the diaper 100 shown in FIGS.1 and 2A, it is to be appreciated that the methods and apparatusesherein may be used to assemble various elastic laminates that can beused with various embodiments of absorbent articles, such as forexample, the absorbent articles disclosed in U.S. Pat. No. 7,569,039,filed on Nov. 10, 2004; U.S. Patent Publication No. 2005/0107764A1,filed on Nov. 10, 2004; U.S. patent application Ser. No. 13/221,127,filed on Aug. 30, 2011; and U.S. patent application Ser. No. 13/221,104,filed on Aug. 30, 2011, which are all hereby incorporated by referenceherein. In other examples, the fluid application apparatuses and methodsherein may be configured to apply adhesives to elastics and substratesto assembly elastic laminates in accordance with the methods andapparatuses disclosed in U.S. patent application Ser. No. 13/434,984,entitled “APPARATUSES AND METHODS FOR MAKING ABSORBENT ARTICLES”, filedon Mar. 30, 2012; U.S. patent application Ser. No. 13/435,036, entitled“APPARATUSES AND METHODS FOR MAKING ABSORBENT ARTICLES”, filed on Mar.30, 2012; U.S. patent application Ser. No. 13/435,063, entitled“APPARATUSES AND METHODS FOR MAKING ABSORBENT ARTICLES”, filed on Mar.30, 2012; U.S. patent application Ser. No. 13/435,247, entitled“APPARATUSES AND METHODS FOR MAKING ABSORBENT ARTICLES”, filed on Mar.30, 2012; and U.S. patent application Ser. No. 13/435,503, entitled“METHODS AND APPARATUSES FOR MAKING LEG CUFFS FOR ABSORBENT ARTICLES”,filed on Mar. 30, 2012, all of which are incorporated by referenceherein.

FIG. 4 shows a perspective view an embodiment of an apparatus 500 forapplying adhesives to a substrate and elastic material. It is to beappreciated that the elastic material may be in various forms, such asfor example, elastic strands, ribbons, and/or panels. The apparatus 500includes a slot die applicator 502 and a substrate carrier 504. As shownin FIG. 4, a substrate 506 and elastic material 507 are advancing in amachine direction and are partially wrapped around the substrate carrier504. More particularly, the substrate 506 includes a first surface 508disposed opposite a second surface 510. And the first surface 508 of thesubstrate 506 is disposed on an outer surface 512 of the substratecarrier 504 while the second surface 510 of the substrate 506 advancespast the slot die applicator 502. In addition, elastic material 507 ispositioned on the second surface 510 of the substrate 506. It is to beappreciated that the elastic material 507 may be in a stretched statewhen positioned on the substrate 506. As discussed in more detail below,the second surface 510 of the substrate 506 and the elastic material 507advance past the slot die applicator 502 and adhesive is transferredfrom the slot die applicator 502 onto the second surface of thesubstrate and the elastic material in a pattern that is substantiallythe same as a pattern defined on the outer surface 512 of the substratecarrier 504. As discussed in more detail below, the substrate carrier504 may be configured in various ways to deposit fluid 530 dischargedfrom a slot die applicator 502 onto a substrate 506 and elastic material507 in various different patterns, such as shown for example in FIGS. 4Athrough 4D. As shown in FIGS. 4A and 4B, the elastic material 507 may bepositioned on the substrate 506 along a straight path. And as shown inFIGS. 4C and 4D, the elastic material 507 may be positioned on thesubstrate 506 along a curved path. In addition, the elastic material 507may be positioned in a stretch state when positioned on the substrate506.

It is to be appreciated that the slot die applicator 502 shown in FIG. 4is a generic representation of a device that is used to apply adhesiveto the substrate 506. The slot die applicator may include a slot opening514, a first lip 516, and a second lip 518. The first lip 516 may alsobe referred to herein as an upstream die lip, and the second lip 518 mayalso be referred to herein as a downstream die lip. The slot opening 514is located between the first lip 516 and the second lip 518. Adhesive orother fluid may be discharged from the slot opening 514 onto the secondsurface 510 of the substrate 506 as the substrate carrier 504 advancesthe substrate past the first lip 516, slot opening 514, and second lip518 of the slot die applicator 502. As discussed in more detail below,the substrate 506 and elastic material 507 are also intermittentlycompressed between the slot die applicator 502 and substrate carrier 504as the substrate 506 advances past the slot die applicator 502. It is tobe appreciated that various forms of slot die applicators may be usedherein to apply adhesive or other fluids to an advancing substrateaccording to methods and apparatuses. For example, U.S. Pat. No.7,056,386 provides a description of slot die applicators that may beused. Other examples of commercially available slot die applicatorsinclude Nordson Corporation's EP11 Series of Slot Die Applicators andITW Dynatec Gmbh's APEX Series of Slot Die Auto Adhesive Applicators.

Various types of substrate carriers 504 may be used in accordance withthe apparatuses and methods herein. For example, FIGS. 5A and 5B show anembodiment of a substrate carrier 504 configured as a roller 520 adaptedto advance a substrate 506 past the slot die applicator 502. The outersurface 512 of the substrate carrier 504 shown in FIGS. 5A and 5Bincludes a plurality of pattern elements 522 that protrude radiallyoutward from a base surface 524. Each pattern element 522 includes apattern surface 526, and the radial protrusion of the pattern elements522 from the base surface 524 define a distance, Hp, between the patternsurface 526 and the base surface 524. As shown in FIGS. 5A and 5B, thebase surface 524 is configured as a continuous surface 528, and theplurality of discrete pattern elements 522 are separated from each otherby the continuous surface 528. The pattern surfaces 526 in FIGS. 5A and5B define a diamond shape. In some embodiments, the shape and size ofthe pattern surface 526 of each pattern element 522 may be identical orsubstantially identical to each other. It is to be appreciated that thenumber, size, and shape of some or all the pattern surfaces and/orpattern elements may be different. In addition, the distance, Hp,between the base surface 524 and the pattern surface 526 of the patternelement 522 may be the same or different for some or all of the patternelements.

As discussed in more detail below, as the substrate carrier 504 advancesthe substrate 506 past the slot die applicator 502, fluid dischargedfrom the slot die applicator is deposited onto the substrate in apattern substantially matching the shapes of the pattern surfaces on thesubstrate carrier. For example, FIG. 5C shows an example pattern offluid 530 deposited on a second surface 510 of a substrate 506 andelastic material 507 after being advanced past a slot die applicatorwhile disposed on a substrate carrier having pattern elements 522 andpattern surfaces 526 similar to those shown in FIGS. 5A and 5B. As shownin FIG. 5C, the fluid 530 is deposited onto the substrate 506 and theelastic material in discrete pattern areas 532 having diamond shapesthat correspond with and may mirror the shapes of the pattern surfaces526 on the substrate carrier 504 shown in FIG. 5A.

FIGS. 6A and 6B show another embodiment of a substrate carrier 504configured as a roller 520 adapted to advance a substrate 506 past theslot die applicator 502. The substrate carrier 504 shown in FIGS. 6A and6B includes a single pattern element 522 including a pattern surface526. And the pattern element 522 protrudes radially outward from aplurality of base surfaces 524. More particularly, the pattern surface526 is configured as a continuous surface 534 and the plurality of basesurfaces are separated from each other by the pattern element 522. Theradial protrusion of the pattern element 522 from the base surfaces 524defines a distance, Hp, between the pattern surface 526 and the basesurfaces 524. The pattern surface 526 in FIGS. 6A and 6B defines acontinuous crossing line pattern wherein the shape and size of each basesurface 524 are identical or substantially identical to each other. Itis to be appreciated that the number, size, and shape of some or all thebase surfaces may be different. In addition, the distance, Hp, betweenthe base surfaces 524 and the pattern surface 526 of the pattern element522 may be the same or different for some or all of the base surfaces.It should also be appreciated that the substrate carrier may beconfigured without base surfaces. For example, the substrate carrier mayinclude a plurality of holes and the pattern surface may be configuredas a continuous surface wherein the plurality of holes are separatedfrom each other by the pattern element.

As previously mentioned, as the substrate carrier 504 advances thesubstrate 506 past the slot die applicator 502, fluid 530 dischargedfrom the slot die applicator 502 is deposited onto the substrate 506 ina pattern substantially matching the shape of the pattern surface 526 onthe substrate carrier 504. For example, FIG. 6C shows an example patternof fluid 530 deposited on a second surface 510 of a substrate 506 andelastic material 507 after being advanced past a slot die applicator 502while disposed on a substrate carrier 504 having a pattern element 522and pattern surface 526 similar to that shown in FIGS. 6A and 6B. Asshown in FIG. 6C, the fluid 530 is deposited onto the substrate 506 andthe elastic material 507 in a crossing line pattern defining diamondshapes therebetween that correspond with and may mirror the shapes ofthe base surfaces 524 on the substrate carrier 504 shown in FIGS. 6A and6B.

As previously mentioned, the substrate carrier may be constructed invarious ways such that the base surface and/or pattern elements mayinclude compliant materials. In some configurations, the compliantmaterial(s) may be compressible to allow a pattern surface of a patternelement to deflect away from the slot die applicator. Thus, thesubstrate carrier may be configured such that deflection of the patternsurface away from the slot die applicator compresses the pattern elementand/or base surface as the substrate, elastic material, and patternelement advance past the first lip, the slot opening, and the second lipof the slot die applicator.

FIG. 7 shows a schematic cross-sectional side view of an examplesubstrate carrier 504 that may be configured with compliant materialsand components that can be compressed and allow the pattern surface 526to deflect in response to a force or forces, F, exerted on the patternsurface 526. The substrate carrier 504 in FIG. 7 is in the form of aroller 520 adapted to rotate around an axis of rotation 505. Inoperation, a force or forces, F, may be exerted on the pattern surface526 as the substrate 506, elastic material 507, and pattern element 522advance past the first lip 516, the slot opening 514, and the second lip518 of the slot die applicator 502. It is to be appreciated that thesubstrate carrier 504 may be configured in various ways with variousdifferent components of compliant materials that allow the patternsurface 526 to deflect.

For example, FIGS. 7A1 and 7A2 show a detailed view of the substratecarrier 504 in the form of a roller 520, such as from FIG. 7, includinga compliant pattern element 522 and a compliant base surface 524connected with a base roll 560 having a non-compliant support surface562. More particularly, the roller 520 in FIGS. 7A1 and 7A2 may includea base layer 564 of compliant material extending radially outward fromthe non-compliant support surface 562 to define the compliant basesurface 524. In some arrangements, the base layer 564 of compliantmaterial may be formed as a cylindrically shaped sleeve or tube 566having an inner radial surface 568 and an outer radial surface 570. Theinner radial surface 568 may surround all or a portion of thenon-compliant support surface 562 of the base roll 560, and the outerradial surface 570 may define all or a portion of the base surface 524.In turn, the pattern element 522 may include a proximal end portion 572and a distal end portion 574 that includes the pattern surface 526,wherein the proximal end portion 572 is connected with outer radialsurface 570 of the base layer 564. As such, the pattern element 522 mayextend radially outward from the base layer 564 of compliant material tothe distal end portion 574. It is to be appreciated that the patternelement 522 may be separately connected with or integrally formed withthe compliant base layer 564. FIG. 7A1 shows the pattern element 522 andbase layer 564 of compliant material in an uncompressed state, whereinthe minimum distance between the pattern surface 526 and thenon-compliant support surface 562 is defined by distance, R1. FIG. 7A2shows the compliant pattern element 522 and compliant base layer 564 ofFIG. 7A1 in a compressed state wherein a force or forces, F, are appliedto the pattern surface 526. Because the pattern element 522 and baselayer 564 are both compliant, the force or forces, F, applied to thepattern surface 526 causes the pattern element 522 and the base layer564 to be compressed against the non-compliant surface 562 of the baseroll 560. The compression of the pattern element 522 and the base layer564 allows the pattern surface 526 to deflect in response to the forces,F. As such, the minimum distance between the pattern surface 526 and thenon-compliant surface 562 is defined as distance, R2, wherein R2 is lessthan R1.

In another example, FIGS. 7B1 and 7B2 show a detailed view of thesubstrate carrier 504 in the form of a roller 520, such as from FIG. 7,including a non-compliant pattern element 522 and a compliant basesurface 524 connected with a base roll 560 having a non-compliantsupport surface 562. More particularly, the roller 520 in FIGS. 7B1 and7B2 may include a base layer 564 of compliant material extendingradially outward from the non-compliant support surface 562 to definethe compliant base surface 524. In some arrangements, the base layer 564of compliant material may be formed as a cylindrically shaped sleeve ortube 566 having an inner radial surface 568 and an outer radial surface570. The inner radial surface 568 may surround all or a portion of thenon-compliant support surface 562 of the base roll 560, and the outerradial surface 570 may define all or a portion of the base surface 524.In turn, the pattern element 522 may include a proximal end portion 572and a distal end portion 574 that includes the pattern surface 526,wherein the proximal end portion 572 is connected with outer radialsurface 570 of the base layer 564. As such, the pattern element 522 mayextend radially outward from the base layer 564 of compliant material tothe distal end portion 574. It is to be appreciated that the patternelement 522 may be separately connected with or integrally formed withthe compliant base layer 564. FIG. 7B1 shows the base layer 564 ofcompliant material in an uncompressed state, wherein the minimumdistance between the pattern surface 526 and the non-compliant supportsurface 562 is defined by distance, R1. FIG. 7B2 shows the compliantbase layer 564 of FIG. 7B1 in a compressed state wherein a force orforces, F, are applied to the pattern surface 526. Because the patternelement 522 is non-compliant and the base layer 564 is compliant, theforce or forces, F, applied to the pattern surface 526 causes thepattern element 522 to push against the base layer 564 such that thebase layer 564 is compressed between the pattern element 522 and thenon-compliant surface 562 of the base roll 560. The compression of thebase layer 564 allows the pattern surface 526 to deflect in response tothe force or forces, F. As such, the minimum distance between thepattern surface 526 and the non-compliant surface 562 is defined asdistance, R2, wherein R2 is less than R1.

In yet another example, FIGS. 7C1 and 7C2 show a detailed view of thesubstrate carrier 504 in the form of a roller 520 from FIG. 4 includinga compliant pattern element 522 connected with a base roll 560. The baseroll 560 includes a non-compliant outer circumferential support surface562 that also defines the base surface 524. In turn, the pattern element522 may include a proximal end portion 572 and a distal end portion 574that includes the pattern surface 526, wherein the proximal end portion572 is connected with non-compliant support surface 562. FIG. 7C1 showsthe pattern element 522 in an uncompressed state, wherein the minimumdistance between the pattern surface 526 and the non-compliant supportsurface 562 is defined by distance, R1. FIG. 7C2 shows the patternelement 522 of FIG. 7C1 in a compressed state wherein a force or forces,F, are applied to the pattern surface 526. Because the pattern element522 is compliant, the force or forces, F, applied to the pattern surface526 causes the pattern element 522 to be compressed against thenon-compliant support surface 562 of the base roll 560. The compressionof the pattern element 522 allows the pattern surface 526 to deflect inresponse to the force or forces, F. As such, the minimum distancebetween the pattern surface 526 and the non-compliant support surface562 is defined as distance, R2, wherein R2 is less than R1. In someinstances, the force or forces, F, may be exerted in a radial directiontoward the axis of rotation 505.

As previously mentioned, the methods and apparatuses herein include asubstrate carrier adapted to advance a substrate and elastic materialpast a slot die applicator. FIG. 8 shows a schematic cross-sectionalside view of an embodiment of a fluid application apparatus 500including a substrate carrier 504 and a slot die applicator 502. Thesubstrate 506 includes a first surface 508 and a second surface 510disposed opposite the first surface 508. A portion of the first surface508 of the substrate 506 is disposed on the substrate carrier 504, whichmay be configured as a roller 520 having a plurality of pattern elements522 protruding from a plurality of base surfaces 524. Advancing elasticmaterial 507 is also positioned on the second surface 510 of thesubstrate 506. It is to be appreciated that the substrate carrier 504shown in FIG. 8 may be configured with various features and aspects ofany substrate carriers discussed herein, including those discussed abovewith reference to FIGS. 4 through 7C2. The roller 520 rotates to advancethe second surface 510 of the substrate 506 and elastic material 507past the slot die applicator 502. It is also to be appreciated that thesubstrate carrier 504 may be configured to advance the substrate 506 ata faster speed than the elastic material 507 upstream of the substratecarrier 504. As such, the elastic material 507 may be stretched whilebeing positioned on the substrate 506. For example, with reference toFIG. 8, the roller 520 may be configured to advance the second surface510 of the substrate 506 past the slot die applicator 502 at a speed ofV1. And the elastic material 507 upstream of the slot die applicator 502is advancing at a speed V2, wherein V1 is greater than V2. Thus, theelastic material 507 may be stretched while being positioned on thesecond surface 510 of the substrate 506.

A fluid delivery system 538 may be used to supply fluid 530, such as anadhesive, to the slot die applicator 502. It is to be appreciated thatthe fluid delivery system may be configured in various different ways.For example, as shown in FIG. 8, the fluid delivery system 538 mayinclude a pump 540 to move fluid from a tank 542 to the slot dieapplicator 502. The fluid delivery system 538 may also be configuredwith a pressure relief valve 544 configured to help control the pressureof the fluid 530 fed from the pump 540. Fluid 530 from the fluiddelivery system 538 passes through the slot die applicator 502 and slotopening 514 and is transferred to the second surface 510 of theadvancing substrate 506 and elastic material 507.

With continued reference to FIG. 8, fluid 530 passing from the slot dieapplicator 502 is transferred to the second surface 510 of the substrate506 and the elastic material 507 in a pattern or shape that issubstantially the same as the pattern surfaces 526 on the substratecarrier 504. As discussed in more detail below, the substrate carrier504 is positioned adjacent the slot die applicator 502 to define aminimum distance between the pattern surface 526 and slot die applicator502, which is less than the sum of the maximum thickness of the elasticmaterial 507 and the unconstrained caliper of the substrate 506. In someconfigurations, the minimum distance between the pattern surface 526 andslot die applicator 502 may be less than the unconstrained caliper ofthe substrate 506. As such, the pattern element and/or base surface maybe compressed to allow the pattern surface 526 of the pattern element todeflect away from the slot die applicator 502 as the substrate 506,elastic material 507, and pattern surface 526 of the pattern element 522advance past the first lip 516, the slot opening 514, and the second lip518 of the slot die applicator 502. However, the minimum distancebetween the base surface 524 of the substrate carrier 504 and the slotdie applicator 502 is greater than the sum of the maximum thickness ofthe elastic material 507 and the unconstrained caliper of the substrate506. As such, the base surface 524 is not compressed as the substrateand elastic material advances past the first lip 516, the slot opening514, and the second lip 518 of the slot die applicator 502. Thus, inoperation, although fluid 530 is continuously discharged from the slotdie applicator 502, fluid 530 is transferred to the advancing substrate506 and elastic material 507 when the pattern element 522 and/or basesurface 524 is compressed as pattern surfaces 526 on the substratecarrier 502 advance past the slot die opening 514 and deflect thepattern surface 526. And fluid 530 is not transferred to the advancingsubstrate 506 and elastic material 507 when the pattern element 522and/or base surface 524 are uncompressed while the base surfaces 524 onthe substrate carrier 504 advance past the slot die opening 514.

As mentioned above, the method and apparatuses may be used to applyelastic material to substrates to make elastic laminates. It is to beappreciated that the elastic laminates may be made in various ways andmay be further modified for incorporation into various types ofarticles. For example, FIGS. 8A through 8C2 show various examples of howthe methods and apparatuses herein may be used to make elastic laminatesfor use in absorbent articles. More particularly, FIGS. 8A through 8C2are described below in the context of making elastic laminates in theform of belt materials 402 that may be used in the assembly of theelastic belts 106, 108 described above with reference to FIGS. 1 through3B.

As shown in FIGS. 8A and 8A1, a first continuous substrate layer in theform of a continuous length of outer layer belt material 162; a secondcontinuous substrate layer in the form of a continuous length of innerlayer belt material 164; and elastics 168 are combined to form acontinuous elastic laminate in the form of a belt material 402. Theelastics 168 shown in FIGS. 8A and 8A1 may be in the form of outerelastic strands 170 and inner elastic strands 172. As discussed below, afluid application apparatus 500, which includes a slot die applicator502 and substrate carrier 504, may be used to apply adhesive theelastics 168 and outer belt material 162 as discussed above withreference to the substrate 506 and elastic material 107. With continuedreference to FIGS. 8A and 8A1, the continuous length of outer layer beltmaterial 162 is advanced in a machine direction onto a substrate carrier504, which is depicted as a roller 520. Stretched outer elastic strands170 and inner elastic strands 172 advance in a machine direction and arecombined with the outer layer belt material 162 at the substrate carrier504. The combined outer layer belt material 162 and elastic strands 170,172 advance on the rotating roller 520 past a slot die applicator 502.In turn, the slot die applicator 502 applies adhesive to the outer layerbelt material 162 and elastic strands 170, 172, such as described abovewith reference to FIGS. 4-8. Referring back to FIGS. 8A and 8A1, theouter belt material 162 and elastics 170, 172 advance from the substratecarrier 504 in a machine direction and are combined with a continuousinner layer belt material 164 at nip rolls 302 to form a continuouslength of belt material 402. It is to be appreciated that the fluidapplication apparatus 500 may be configured to apply adhesive in variousways to the elastic strands 170, 172 as well as either or both of thecontinuous lengths of outer layer belt material 162 and inner layer beltmaterial 164 before entering nip rolls 502. For example, adhesive 530may be applied continuously along the lengths of outer layer beltmaterial 162 and outer elastic strands 170, and adhesive may be appliedintermittently along the lengths of the inner elastic strands 172 and/orintermittently along the continuous length of outer layer belt material162.

As shown in FIG. 8A1, the inner elastic strands 172 are intermittentlybonded to either or both of the continuous lengths of outer layer beltmaterial 162 and inner layer belt material 164 along the machinedirection MD. More particularly, as shown in FIG. 8A1, the belt material402 may include non-bonded regions 403 intermittently spaced betweenbonded regions 405 along the machine direction MD. Thus, the innerelastic strands 172 are not bonded to either the outer layer beltmaterial 162 or inner layer belt material 164 in the non-bonded regions403. And the inner elastic strands 172 are bonded to the outer layerbelt material 162 and/or inner layer belt material 164 in the bondedregions 405. For the purposes of clarity, dashed lines 401 are shown inFIG. 8A1 to represent example boundaries between the non-bonded regions403 and the bonded regions 405. It is to be appreciated that suchboundaries between the non-bonded regions 403 and the bonded regions 405can also be curved, angled, and/or straight. Although the inner elasticstrands 172 are not bonded to the either the outer layer belt material162 or inner layer belt material 164 in the non-bonded regions 403,adhesive 530 may be applied in areas between the individual innerelastic strands 172 to bond the outer layer belt material 162 and innerlayer belt material 164 together in the non-bonded regions 403.

Although FIG. 8A shows an embodiment wherein the belt material 402 isformed by combining continuous lengths of outer layer belt material 162and inner layer belt material 164 with elastic strands 168, it is to beappreciated the belt material 402 can be formed in various other ways.For example, the belt material 402 may be formed by a folding portion ofa single continuous substrate onto another portion of the singlecontinuous substrate. For example, FIGS. 8B and 8B1 show a configurationwherein the belt material 402 is formed by combining continuous lengthsof elastic strands 168 with a single continuous length of belt material160 having a first surface 161 a and an opposing second surface 161 b.More particularly, the continuous lengths of stretched outer elasticstrands 170 and inner elastic strands 172 are advanced in a machinedirection MD and combined with the first surface 161 a of the beltmaterial 160 at a substrate carrier 504. The combined belt material 160and elastic strands 170, 172 advance on the rotating roller 520 past aslot die applicator 502. In turn, the slot die applicator 502 appliesadhesive 530 to the belt material 160 and elastic strands 170, 172, suchas described above with reference to FIGS. 4-8. Referring back to FIGS.8B and 8B1, the belt material 160 and elastics 170, 172 advance from thesubstrate carrier 504 in a machine direction to a folding apparatus 304adapted to fold a portion of the first surface 161 a of the beltmaterial 160 onto another portion of the first surface 161 a such thatthe elastics 170, 172 are intermittently bonded between the foldedportions of the belt material 160. In the arrangement shown in FIGS. 8Band 8B1, adhesive 530 may be applied intermittently to the elasticstrands 170, 172 and/or the continuous length of belt material 160before entering the folder 304. For example, FIG. 8B1 shows anarrangement wherein the belt material 160 includes opposing longitudinaledges 160 a, 160 b and laterally opposed edge regions 166 a, 166 bseparated by a central region 166 c. And the elastics are combined withthe central region 166 c of the first surface 161 a of the belt material160. The folder 304 folds the opposing edge regions 166 a, 166 b ontothe central region 166 c. As such, the elastics are sandwiched betweenthe first surface 161 a of the opposing edge regions 166 a, 166 b andthe first surface 161 a of the central region 166 c. Thus, an elasticlaminate 402 can be formed wherein a first substrate layer may comprisethe central region 166 c, and wherein a second substrate layer maycomprise the folded edge regions 166 a, 166 b.

It is to be appreciated that the belt material may be folded in variousways at the folder 304. For example, in some embodiments, the elastics168 may be combined with the belt material 160 in such a way that thefolder 304 need only fold the belt material 160 once along the centerregion 166 c. For example, the folder 304 may fold the first surface 161a of the belt material 160 onto itself such that the first longitudinaledge 161 a is aligned with the second longitudinal edge 161 b.

Yet another example configuration is shown in FIGS. 8C through 8C2 thatutilizes a first fluid application device 500 a and a second fluidapplication device 500 b. In particular, the belt material 402 is formedby first combining continuous lengths of outer elastic strands 170 withthe opposing edge regions 166 a, 166 b of single continuous length ofbelt material 160 at a first substrate carrier 504 a in the form of aroller 520 a. Before being combined at roller 520 a, the outer elasticstrands 170 are stretched in the machine direction MD. The first slotdie applicator 502 a applies adhesive 530 to the elastics 170 and beltmaterial 160 while advancing on the rotating roller 520 a. From theroller 520 a, the combined elastics 170 and the belt material 160advance to a folding apparatus 304 adapted to fold the opposing edgeregions 166 a, 166 b onto themselves. As such, the outer elastics 170are sandwiched between first surfaces 161 a of the opposing edge regions166 a, 166 b, such as shown in FIG. 8C1. Referring back to FIG. 8C,stretched inner elastics 172 and the inner belt material 164 arecombined at a second substrate carrier 504 b in the form of a roller 520b. The second slot die applicator 502 b applies adhesive 530 to theelastics 172 and belt material 164 while advancing on the rotatingroller 520 b. From the roller 520 b, the advancing inner elastics 172and inner belt material 164 are combined with the outer elastics 170 andbelt material 160 at nip rolls 302 to form the belt material 402 asshown in FIG. 8C2. Thus, an elastic laminate can be formed wherein thefirst substrate layer may comprise portion of the folded edge regions166 a, 166 b and/or the central region 166 c, and wherein the secondsubstrate layer may comprise portions of the folded edge regions 166 a,166 b and/or the central region 166 c, and the belt material 164.

In some converting configurations, the elastic laminate 402 may besubjected to various additional operations, such as described in U.S.patent application Ser. No. 13/434,984, entitled “APPARATUSES ANDMETHODS FOR MAKING ABSORBENT ARTICLES”, filed on Mar. 30, 2012; U.S.patent application Ser. No. 13/435,036, entitled “APPARATUSES ANDMETHODS FOR MAKING ABSORBENT ARTICLES”, filed on Mar. 30, 2012; U.S.patent application Ser. No. 13/435,063, entitled “APPARATUSES ANDMETHODS FOR MAKING ABSORBENT ARTICLES”, filed on Mar. 30, 2012; U.S.patent application Ser. No. 13/435,247, entitled “APPARATUSES ANDMETHODS FOR MAKING ABSORBENT ARTICLES”, filed on Mar. 30, 2012; and U.S.patent application Ser. No. 13/435,503, entitled “METHODS ANDAPPARATUSES FOR MAKING LEG CUFFS FOR ABSORBENT ARTICLES”, filed on Mar.30, 2012, all of which are incorporated by reference herein. Forexample, a cutting unit may intermittently deactivate the elastics 172in by severing, cutting, and/or breaking the inner elastics 172 in thenon-bonded regions 403. As such, severed ends of the inner elastics 172may retract or snap back to the bonded regions 405.

A more detailed description of fluid transfer from the slot dieapplicator 502 to the substrate 506 and elastic material 507 is providedwith reference to FIGS. 9A through 9E. FIG. 9A is a detailedcross-sectional view of the substrate carrier of FIG. 8 shown withoutthe substrate 506 and elastic material 507 wherein the pattern surface526 of a pattern element 522 is adjacent a first lip 516, a second lip518, and slot opening 514 of the slot die applicator 502. As shown inFIG. 9A, the substrate carrier 504 includes a non-compliant supportsurface 562, a base surface 524, and a pattern element 522 protrudingfrom base surface 524. In an uncompressed state, the pattern element 522protrudes outward from the base surface 524 to define a distance, Hp,between the pattern surface 526 and the base surface 524, and to definea minimum distance, R1, between the pattern surface 526 and thenon-compliant support surface 562. The substrate carrier 504 is alsopositioned adjacent the slot die applicator 502 to define a minimumdistance, Hg, between the pattern surface 526 of the uncompressedpattern element 522 and the first lip 516 and the second lip 518. Asdiscussed below, the minimum distance, Hg, is less than the sum of theunconstrained caliper, Hs, of the substrate 506 and the maximumthickness, Et, of the elastic material 507 advanced by the substratecarrier 504. In addition, the substrate carrier 504 is positionedadjacent the slot die applicator 502 to define a minimum distance, Hb,between the base surface 524 and the first lip 516 and the second lip518. As discussed below, the minimum distance, Hb, may be greater thanthe sum of the unconstrained caliper, Hs, of the substrate 506 and themaximum thickness, Et, of the elastic material 507 advanced by thesubstrate carrier 504.

FIG. 9B is a detailed cross-sectional view of a substrate carrier 504 ofFIG. 9A and a substrate 506 and elastic material 507 advancing past aslot die applicator 502. The substrate 506 has an unconstrained caliper,Hs, and has a first surface 508 disposed opposite of a second surface510. An elastic material 507 is positioned on the second surface 510 ofthe substrate 506. The first surface 508 of the substrate 506 isdisposed on the substrate carrier 504. And the substrate 506, elasticmaterial 507, and substrate carrier 504 are shown as advancing togetherin a machine direction, MD, past the slot die applicator 502. Moreparticularly, the second surface 510 of the substrate 506 and theelastic material 507 are advancing past a slot opening 514 locatedbetween an upstream lip 516 and a downstream lip 518 of the slot dieapplicator 502. As previously mentioned, the substrate carrier 504 ispositioned adjacent the slot die applicator 502 to define a minimumdistance, Hg, between the pattern surface 526 of the uncompressedpattern element 522 and the first lip 516 and the second lip 518 that isless than the sum of the maximum thickness, Et, of the elastic material507 and the unconstrained caliper, Hs, of the substrate 506. Inaddition, the substrate carrier 504 is positioned adjacent the slot dieapplicator 502 to define a minimum distance, Hb, between the basesurface 524 and the first lip 516 and the second lip 518 that is greaterthan the sum of the maximum thickness, Et, of the elastic material 507and unconstrained caliper, Hs, of the substrate 506. The apparatus 500may also be configured such that a sum of the distance, Hp, anddistance, Hg, is greater than the sum of the unconstrained caliper, Hs,of the substrate 506 and the maximum thickness, Et, of the elasticmaterial 507. Thus, a portion 506 a, 507 a of the substrate 506 and theelastic material 507 that is located between the slot opening 514 of theslot die applicator 502 and the advancing base surface 524 is notpressed against the base surface 524. As such, although fluid 530 iscontinuously discharged from the slot opening 514, fluid 530 is notbeing transferred to the second surface 510 of the substrate 506 and theelastic material 507.

FIG. 9C is a detailed cross-sectional view of the substrate carrier 504,substrate 506, and elastic material 507 of FIG. 9B wherein the basesurface 524 has advanced past the slot opening 514 of the slot dieapplicator 502 such that a portion 506 b, 507 b of the substrate 506 andelastic material 507 is between the first lip 516 of the slot dieapplicator 502 and a leading edge 546 of an advancing pattern surface526. As previously discussed, the minimum distance, Hg, between thepattern surface 526 of the uncompressed pattern element 522 and thefirst lip 516 and the second lip 518 is less than the sum of theunconstrained caliper, Hs, of the substrate 506 and the maximumthickness, Et, of the elastic material 507. As such, a portion 506 b,507 b of substrate 506 and the elastic material 507 b between thepattern surface 526 and the first lip 516 is pressed against and exertsforces on the pattern surface 526. Thus, the pattern element 522 and/orbase surface 524 compresses, allowing the pattern surface 526 to deflectaway from the first lip 516 to define a minimum distance, R2, betweenthe pattern surface 526 and the non-compliant support surface 562. Thefluid 530 being discharged from the slot opening 514 is shown in FIG. 9Cas beginning to transfer to the second surface 510 of the substrate andthe elastic material 507 as the leading edge 546 of the pattern surface526 and adjacent portion of the substrate 506 begin to advance past theslot opening 514.

With continued reference to FIG. 9C, the compression of the patternelement 522 and/or base surface 524 allows the pattern surface 526 todeflect away from the first lip 516 to define a compressed distance, Hc,between the pattern surface 526 and the first lip 516. When thesubstrate 506 is made from a material, such as a film, the substrate 506may maintain a caliper that is substantially the same as theunconstrained caliper, Hs, while advancing between the pattern surface526 and the first lip 516. Thus, the pattern surface 526 may deflect bya distance represented by the difference of Hg and the sum of Hs and Et,and in some instances, the distance R2, may be calculated as:

R2=R1+Hg−Hs−Et

In such a scenario, the compressed distance, Hc, may also be equal to orsubstantially equal to the sum of the unconstrained caliper, Hs, and themaximum thickness, Et, of the elastic material.

Still referring to FIG. 9C, when the substrate 506 is made from amaterial, such as a nonwoven or laminate including a nonwoven layer, thesubstrate 506 may be compressed to a caliper that is less than theunconstrained caliper, Hs, while advancing between the pattern surface526 and the first lip 516. In such a scenario, the compressed distance,Hc, may be less than the sum of the unconstrained caliper, Hs, and themaximum thickness, Et, of the elastic material. In other words, thesubstrate 506 may be compressed to a caliper that is less than thecompressed distance, Hc. Thus, the pattern surface 526 may deflect by adistance represented by the difference of Hg and Hc, and in someinstances, the distance R2, may be calculated as:

R2=R1+Hg−Hc

In some instances, the elastic material 507 may define a crossdirectional width dimension that is less than the pattern surface 526.As such, pattern surface 526 may deflect by different distances whenadvancing past the slot die applicator 502. For example, FIG. 9CC1 showsa cross sectional view of the pattern element 522 of FIG. 9C wherein thepattern surface is deflected by different distances, wherein the elasticmaterial 507 is in the form of an elastic strand 507 a. As shown in FIG.9CC1, the location where both the advancing elastic strand 507 andsubstrate 506 are between slot die applicator 502 and the patternelement 522, a first portion 526 a of the pattern surface 526 isdeflected away from the first lip 516 to define a minimum distance, R2,between the pattern surface 526 and the non-compliant support surface562, wherein R2 may be calculated as described above. In addition, thelocation where only the advancing substrate 506 is between slot dieapplicator 502 and the pattern element 522, a second portion 526 b ofthe pattern surface 526 is deflected away from the first lip 516 todefine a distance, R3, between the pattern surface 526 and thenon-compliant support surface 562, wherein R3 is greater than R2 andless than R1.

As such, when the substrate 506 is made from a material, such as a film,the substrate 506 may maintain a caliper that is substantially the sameas the unconstrained caliper, Hs, while advancing between the patternsurface 526 and the first lip 516. Thus, the second portion 526 b of thepattern surface 526 may deflect by a distance represented by thedifference of Hg and Hs, and in some instances, the distance R3, may becalculated as:

R3=R1+Hg−Hs

With continued reference to FIG. 9CC1, when the substrate 506 is madefrom a material, such as a nonwoven or laminate including a nonwovenlayer, the substrate 506 may be compressed to a caliper that is lessthan the unconstrained caliper, Hs, while advancing between the patternsurface 526 and the first lip 516. Thus, the second portion 526 b of thepattern surface 526 may deflect by a distance represented by:

R3<R1+Hg−Hs

As previously mentioned, the elastic material 507 may be in variousforms, such as for example, elastic strands, ribbons, and/or panels. Forexample, similar to FIG. 9CC1, FIG. 9CC2 shows a cross sectional view ofthe pattern element 522 of FIG. 9C wherein the pattern surface isdeflected by different distances reflected by R2 and R3, wherein theelastic material 507 is in the form of an elastic ribbon 507 b.

FIG. 9D is a detailed cross-sectional view of the substrate carrier 504and substrate of FIG. 9C wherein the base surface 524 and leading edge546 of the pattern surface 526 has advanced past the slot opening 514 ofthe slot die applicator 502 such that the portion 506 b, 507 b of theadvancing substrate 506 and elastic material 507 is between the slotopening 514 of the slot die applicator 502 and an advancing patternsurface 526. Because the minimum distance, Hg, between the patternsurface 526 of the uncompressed pattern element 522 and the first lip516 and the second lip 518 is less than the sum of the unconstrainedcaliper, Hs, of the substrate 506 and the maximum thickness, Et, of theelastic material 507, the portion 506 b, 507 b of substrate 506 andelastic material 507 between the pattern surface 526 and the first lip516 and second lip 518 of the slot die applicator 502 presses againstand exerts forces on the pattern surface 526. As such, the compliantpattern element 522 and/or base surface 524 are compressed, allowing thepattern surface 526 to deflect away from the first lip 516 and secondlip 518, as discussed above with reference to the distance R2. The fluid530 being discharged from the slot opening 514 is shown in FIG. 9D asbeing transferred to the second surface 510 of the substrate 506 and theelastic material 507 as the pattern surface 526 and adjacent portion 506b, 507 b of the substrate 506 and the elastic material 507 advance pastthe slot opening 514.

FIG. 9E is a detailed cross-sectional view of the substrate carrier 504,substrate 506, and elastic material 507 of FIG. 6D wherein the portion506 b, 507 b of the substrate 506, the elastic material 507, and thepattern surface 526 have advanced past the slot opening 514 of the slotdie applicator 502. As shown in FIG. 9E, an upstream portion 526 a ofthe pattern surface 526 is adjacent the second lip 518, and a downstreamportion 526 b of the pattern surface 526 has advanced past the secondlip 518. As such, the portion 506 b, 507 b of the advancing substrate506 and elastic material 507 between the second lip 518 of the slot dieapplicator 502 and the upstream portion 526 a of the advancing patternsurface 526 presses against and exerts forces on the pattern surface526. As such, the compliant pattern element 522 and/or base surface 524are compressed, allowing the upstream portion 526 a of the patternsurface 526 to deflect away from the first lip 516 and second lip 518 todefine the minimum distance, R2, between the upstream portion 526 a ofthe pattern surface 526 and the non-compliant support surface 562.

With continued reference to FIG. 9E, the downstream portion 526 b of thepattern surface 526 has advanced past the second lip 518 of the slot dieapplicator 502, and as such, the portion 506 b, 507 b of the substrate506 and elastic material 507 is no longer pressing against downstreamportion 526 b of the pattern surface 526, allowing the compliant patternelement 522 and/or base surface 524 to return to an uncompressed statewherein the downstream portion 526 b of the pattern surface 526 deflectsback away from the non-compliant surface 562 such that the minimumdistance between the non-compliant surface 562 and the downstreamportion 526 b pattern surface 526 is the distance, R1. Once the upstreamportion 526 a of the pattern surface 526 has also advanced past thesecond lip 518, the remainder of the compliant pattern element 522and/or base surface 524 may return to an uncompressed state wherein theboth the upstream portion 526 a and downstream portion 526 b of thepattern surface 526 have deflected away from the non-compliant surface562 such that the minimum distance between the non-compliant surface 562and the pattern surface 526 is the distance, R1.

Still referring to FIG. 9E, an uncompressed portion 506 c, 507 c of theadvancing substrate 506 and the elastic material 507 is between the slotopening 514 of the slot die applicator 502 and an advancing base surface524. Because the minimum distance, Hb, between the base surface 524 andthe first lip 516 and the second lip 518 that is greater than the sum ofthe unconstrained caliper, Hs, of the substrate and the maximumthickness, Et, of the elastic material 507, a portion 506 c, 507 c ofsubstrate 506 and elastic material 507 that advances between the basesurface 524, slot opening 514, and the first lip 516 of the slot dieapplicator 502 is uncompressed. As such, the fluid 530 being dischargedfrom the slot opening 514 is shown in FIG. 9E as ceasing to betransferred to the second surface 510 of the substrate 506 and theelastic material 507 as the base surface 524 and adjacent uncompressedportion 506 c, 507 c of the substrate 506 and elastic material 507advance past the slot opening 514.

As previously mentioned, various forms and configurations of substratecarriers may be used with the presently disclosed methods andapparatuses. For example, FIG. 10 shows a schematic cross-sectional sideview of an embodiment of a fluid application apparatus 500 with asubstrate carrier 504 including an endless pattern belt 548. The patternbelt 548 is wrapped around two rollers 550 adapted to advance patternbelt 548 and substrate past the slot die applicator 502. The patternbelt 548 may include various different combinations, shapes, and typesof pattern elements 522 and base surfaces 524 and/or holes 536 asprevious described. As shown in FIG. 10, the slot die applicator 502 isadjacent the pattern belt 548 at a location where the pattern belt 548is partially wrapped around one of the rollers 550. It is to beappreciated that the slot die applicator 502 may be located adjacent toother locations of the pattern belt 548. For example, FIG. 11 shows aschematic cross-sectional side view of an embodiment of a fluidapplication apparatus 500 wherein the slot die applicator 502 isadjacent the pattern belt 548 at a location between the rollers 550. AndFIG. 12 shows a schematic cross-sectional side view of the embodiment ofFIG. 8 with a backup plate 552 located behind the pattern belt 548,wherein the backup plate 548 provides support to the pattern belt 548 tohelp prevent the pattern belt from deflecting away from the slot dieapplicator 502.

With reference to the above description and associated figures, it is tobe appreciated that the apparatuses 500 herein may be used to applyadhesive 530 discharged from a slot die applicator 502 to a substrate506 and elastic material 507 in a pattern by continuously advancing thesubstrate and elastic material 507 in a machine direction past a firstlip 516, second lip 518, and slot opening 514 in the slot die applicator502. The substrate 506 may be engaged with a substrate carrier 504 thatmay include a base surface 524 and a pattern element 522, wherein thepattern element includes a pattern surface 526. The pattern element 522protrudes from the base surface 524 to define a distance, Hp, betweenthe pattern surface 526 and the base surface 524. As previouslymentioned, in some embodiments, the substrate carrier may include holes536 instead of or in combination with base surfaces 526 adjacent thepattern element 522. The substrate carrier 504 is positioned adjacentthe slot die applicator 502 to define a minimum distance, Hg, betweenthe pattern surface 526 of the uncompressed pattern element 522 and thefirst lip 516 and the second lip 518 that is less than the sum of theunconstrained caliper, Hs, of the substrate 506 and the maximumthickness, Et, of the elastic material 507. The second surface 510 ofthe substrate 506 and elastic material 507 may be advanced past the slotdie applicator 502 while the first surface 508 of the substrate 506 isdisposed on the substrate carrier 504. And the substrate 506 and elasticmaterial 507 are intermittently compressed between the slot dieapplicator 502 and the pattern surface 526 of the pattern element 522 byadvancing the pattern element as the pattern surface of the patternelement advances past the first lip 516, the slot opening 514, and thesecond lip 518 of the slot die applicator 502 while the first surface508 of the substrate 506 is disposed on the substrate carrier 504.

It is to be appreciated that the methods and apparatuses herein maydeposit fluids, such as adhesives, onto advancing a substrate advancingin a machine direction MD in various designs or patterns. In the contextof the previous discussion, the apparatuses and methods herein may beused to provide for the application adhesives in patterns to substratesand components during the manufacture of an absorbent article. Forexample, adhesives may be applied in various patterns to portions of anyof the topsheet, backsheet films, backsheet nonwovens, absorbent core,core encapsulation webs, acquisition layer, surge layer, secondarytopsheet layer, leg cuffs, waist feature, ears, and fastening elementsduring the manufacture of an absorbent article. In some instances, theadhesive may be a different color than that of the substrate. In someapplications, the apparatuses and methods herein may be adapted to applyadhesives in absorbent core assembly processes, such as described forexample in U.S. Patent Publication Nos. US2006/0021695A1;US2006/0048880A1; US2008/0215166A1; and US2010/0051166A1. In someinstances, the apparatuses and methods herein may be configured to applyfluid formulations in the form of wetness indicators, such as disclosedfor example in U.S. Patent Publication No. US2011/0137274A1. In yetother instances, the apparatuses and methods herein may be configured toapply fastening adhesives for feminine care articles, including sanitarynapkins, panty liners, adult incontinence pads, and the like, such asdisclosed for example in European Patent Publication No. EP0745368A1.

The dimensions and values disclosed herein are not to be understood asbeing strictly limited to the exact numerical values recited. Instead,unless otherwise specified, each such dimension is intended to mean boththe recited value and a functionally equivalent range surrounding thatvalue. For example, a dimension disclosed as “40 mm” is intended to mean“about 40 mm.”

Every document cited herein, including any cross referenced or relatedpatent or application, is hereby incorporated herein by reference in itsentirety unless expressly excluded or otherwise limited. The citation ofany document is not an admission that it is prior art with respect toany invention disclosed or claimed herein or that it alone, or in anycombination with any other reference or references, teaches, suggests ordiscloses any such invention. Further, to the extent that any meaning ordefinition of a term in this document conflicts with any meaning ordefinition of the same term in a document incorporated by reference, themeaning or definition assigned to that term in this document shallgovern.

While particular embodiments of the present invention have beenillustrated and described, it would be obvious to those skilled in theart that various other changes and modifications can be made withoutdeparting from the spirit and scope of the invention. It is thereforeintended to cover in the appended claims all such changes andmodifications that are within the scope of this invention.

What is claimed is:
 1. A method for applying adhesive discharged from aslot die applicator to a substrate and an elastic material, the slot dieapplicator including a slot opening, a first lip, and a second lip, theslot opening located between the first lip and the second lip; whereinthe substrate has a first surface disposed opposite of a second surfaceand an unconstrained caliper, Hs, and wherein the elastic material has amaximum thickness, Et, the method comprising the steps of: stretchingthe elastic material; positioning the elastic material on the secondsurface of the substrate; engaging the substrate with a substratecarrier, the substrate carrier comprising: a non-compliant supportsurface and a pattern element, the pattern element including a patternsurface, the substrate carrier positioned adjacent the slot dieapplicator to define a minimum distance, Hg, between the pattern surfaceof the pattern element and the first lip and the second lip of the slotdie applicator that is less than the unconstrained caliper, Hs, of thesubstrate; intermittently deflecting a first portion of the patternsurface toward the non-compliant support surface by advancing thesubstrate between the pattern element and the first lip, the slotopening, and the second lip of the slot die applicator while the firstsurface of the substrate is disposed on the substrate carrier; anddischarging adhesive from the slot opening of the slot die applicatoronto the second surface of the substrate.
 2. The method of claim 1,wherein the pattern element extends away from the non-compliant supportsurface to define a first minimum distance, R1, between the patternsurface and the non-compliant support surface, and wherein the step ofintermittently deflecting further comprises defining a second minimumdistance, R2, between the pattern surface and the non-compliant surface,wherein R2 is less than R1,
 3. The method of claim 2, further comprisingthe step of: intermittently deflecting a second portion of the patternsurface toward the non-compliant support surface such to define a thirdminimum distance, R3, between the pattern surface and the non-compliantsurface, wherein R3 is less than R1, and wherein R3 is greater than R2,by advancing the substrate between the pattern element and the firstlip, the slot opening, and the second lip of the slot die applicatorwhile the first surface of the substrate is disposed on the substratecarrier.
 4. The method of claim 1, wherein the substrate carriercomprises a roller.
 5. The method of claim 1, wherein the elasticmaterial comprises an elastic strand.
 6. The method of claim 1, whereinthe elastic material comprises an elastic ribbon.
 7. The method of claim1, wherein the substrate comprises a nonwoven.
 8. The method of claim 1,wherein the substrate comprises a nonwoven layer and a film layer.
 9. Amethod for applying adhesive discharged from a slot die applicator to asubstrate and an elastic material, the slot die applicator including aslot opening, a first lip, and a second lip, the slot opening locatedbetween the first lip and the second lip of the slot die applicator;wherein the substrate has a first surface disposed opposite of a secondsurface and an unconstrained caliper, Hs, and wherein the elasticmaterial has a maximum thickness, Et, the method comprising the stepsof: stretching the elastic material; positioning the elastic material onthe substrate; engaging the substrate with a substrate carrier, thesubstrate carrier comprising: a pattern element including a patternsurface, the substrate carrier positioned adjacent the slot dieapplicator to define a minimum distance, Hg, between the pattern surfaceof the pattern element and the first lip and the second lip that is lessthan the unconstrained caliper, Hs, of the substrate; intermittentlydeflecting a first portion of the pattern surface away from the slot dieapplicator by advancing the substrate between the pattern element andthe first lip, the slot opening, and the second lip of the slot dieapplicator while the first surface of the substrate is disposed on thesubstrate carrier; and discharging adhesive from the slot opening of theslot die applicator onto the substrate.
 10. The method of claim 9,wherein the substrate carrier comprises a roller.
 11. The method ofclaim 9, wherein the substrate carrier comprises an endless belt. 12.The method of claim 9, wherein the elastic material comprises an elasticstrand.
 13. The method of claim 9, wherein the elastic materialcomprises an elastic ribbon.
 14. The method of claim 9, wherein thesubstrate comprises a nonwoven.
 15. The method of claim 9, wherein thesubstrate comprises a nonwoven layer and a film layer.
 16. A method formaking an elastic laminate, the method comprising the steps of:advancing a substrate, the substrate comprising a first surface disposedopposite of a second surface; stretching the elastic material;positioning the elastic material on the substrate; engaging thesubstrate with a substrate carrier, the substrate carrier comprising: apattern element including a pattern surface, the substrate carrierpositioned adjacent the slot die applicator to define a minimumdistance, Hg, between the pattern surface of the pattern element and thefirst lip and the second lip of the slot die applicator that is lessthan the unconstrained caliper, Hs, of the substrate; advancing thesecond surface of the substrate past the slot die applicator while thefirst surface of the substrate is disposed on the substrate carrier;intermittently deflecting a first portion of the pattern surface awayfrom the slot die applicator by advancing the substrate between thepattern element and the first lip, the slot opening, and the second lipof the slot die applicator while the first surface of the substrate isdisposed on the substrate carrier; and discharging adhesive from theslot opening of the slot die applicator onto the substrate.
 17. Themethod of claim 16, further comprising the step of: folding a firstportion of the second surface the substrate onto the elastic material.18. The method of claim 16, further comprising the step of: adhering asecond substrate with the second surface of the substrate and theelastic material.